Chengkuo Lee received the M.S. degree in materials science and engineering from National TsingHua University, Hsinchu, Taiwan, in 1991, the M.S. degree in industrial and system engineering from Rutgers University, New Brunswick, NJ, USA, in 1993, and the Ph.D. degree in precision engineering from The University of Tokyo, Tokyo, Japan, in 1996. He was a Foreign Researcher with the Nanometerscale Manufacturing Science Laboratory of the Research Center for Advanced Science and Technology, The University of Tokyo, from 1993 to 1996. He was with the Mechanical Engineering Laboratory, AIST, MITI of Japan, as a JST Research Fellow, in 1996. Thereafter, he became a Senior Research Staff Member of the Microsystems Laboratory, Industrial Technology Research Institute, Hsinchu. In 1997, he joined Metrodyne Microsystem Corporation, Hsinchu, and established the MEMS Device Division and the first micromachining fab for commercial purposes in Taiwan. He was the Manager of the MEMS Device Division between 1997 and 2000. He was an Adjunct Assistant Professor with the Electro-Physics Department, National Chiao Tung University, Hsinchu, in 1998, and an Adjunct Assistant Professor with the Institute of Precision Engineering, National Chung Hsing University, Taichung, Taiwan, from 2001 to 2005. In 2001, he cofounded Asia Pacific Microsystems, Inc., Hsinchu, where he first became Vice President of Research and Development, before becoming Vice President of the Optical Communication Business Unit and Special Assistant to the Chief Executive Officer in charge of international business and technical marketing for the MEMS foundry service. He was a Senior Member of the Technical Staff at the Institute of Microelectronics, A*STAR, Singapore, from 2006 to 2009. Currently, he is an Associate Professor with the Department of Electrical and Computer Engineering, National University of Singapore, Singapore. He is the coauthor of Advanced MEMS Packaging (McGraw-Hill, 2010). He has contributed to more than 190 international conference papers and extended abstracts and 130 peer-reviewed international journal articles in the fields of sensors, actuators, energy harvesting, MEMS, NEMS, nanophotonics, and nanotechnology. He holds nine U.S. patents.
主要的学术贡献:利用PIN-PMN-PT弛豫铁电单晶制备出迄今推力最大(驱动力/重量比值)的微型超声电机,研究发表于IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control期刊;提出压电-磁致伸缩双层复合材料的磁-弹-电共振耦合模型,研究结果发表于IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control期刊;首次成功制备出基于无铅压电陶瓷材料(Bi0.5Na0.5TiO3系和(K,Na)NbO3系)的压电变压器,研究结果发表于Journal of Material Science、Review of Scientific Instruments等期刊上;提出利用阻抗分析研究CaCu3Ti4O12陶瓷电阻、电容随偏置电压变化特性的方法,研究结果发表于Journal of Applied Physics期刊。